Scientific Results

Very large spot size effect in nanosecond laser drilling efficiency of silicon

Year: 2010

Authors: Brandi F., Burdet N., Carzino R., Diaspro A.

Autors Affiliation: Nanophysics Group, Italian Institute of Technology, Via Morego 30, Genova, Italy

Abstract: The effect of the spot diameter in nanosecond excimer laser percussiondrilling of through via in silicon wafer is presented. Experimental resultsshow a ten fold increase of the ablation efficiency when decreasing the spot diameter from 220 µm to 9 µm at constant fluence in the range 7.5 J/cm2 to 13.2 J/cm2. Such effect is absent when using 60 ps deep-UV laser pulses. A model is developed that explain the findings in terms of plume shielding effect on the laser pulse. The model is successfully applied also on previously published data on deep-UV laser drilling of Polyimide and Alumina.

Journal/Review: OPTICS EXPRESS

Volume: 18 (22)      Pages from: 23488  to: 23494

DOI: 10.1364/OE.18.023488

Citations: 25
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