Very large spot size effect in nanosecond laser drilling efficiency of silicon
Authors: Brandi F., Burdet N., Carzino R., Diaspro A.
Autors Affiliation: Nanophysics Group, Italian Institute of Technology, Via Morego 30, Genova, Italy
Abstract: The effect of the spot diameter in nanosecond excimer laser percussiondrilling of through via in silicon wafer is presented. Experimental resultsshow a ten fold increase of the ablation efficiency when decreasing the spot diameter from 220 µm to 9 µm at constant fluence in the range 7.5 J/cm2 to 13.2 J/cm2. Such effect is absent when using 60 ps deep-UV laser pulses. A model is developed that explain the findings in terms of plume shielding effect on the laser pulse. The model is successfully applied also on previously published data on deep-UV laser drilling of Polyimide and Alumina.
Journal/Review: OPTICS EXPRESS
Volume: 18 (22) Pages from: 23488 to: 23494
KeyWords: UV LASER; ABLATION; PULSESDOI: 10.1364/OE.18.023488Citations: 23data from “WEB OF SCIENCE” (of Thomson Reuters) are update at: 2019-10-13References taken from IsiWeb of Knowledge: (subscribers only)Connecting to view paper tab on IsiWeb: Click hereConnecting to view citations from IsiWeb: Click here