Investigation of silicon MEMS structures subjected to thermal loading by digital holography
Year: 2003
Authors: Ferraro P., De Nicola S., Finizio A., Coppola G., Iodice M., Grilli S., Magro C., Pierattini G.
Autors Affiliation: Istituto Nazionale di Ottica Applicata, Via Campi Flegrei 34, 80078 Pozzuoli (NA), Italy;
Istituto di Cibernetica “E. Caianiello” del CNR, Via Campi Flegrei 34, 80078 Pozzuoli (NA), Italy;
Istituto per la Microelettronica e i Microsistemi (IMM, Sez. di Napoli) del CNR, Sez. di Napoli, Via Diocleziano 328, 80124 Napoli, Italy;
Si-based optoelectronics, Bio-& Nano-systems group, STMicroelectronics srl, Stradale Primosole 50, 95121 Catania, Italy
Abstract: In this paper we study silicon MEMS (Microelectromechanical systems) structures subjected to thermal loading. Digital holography has been investigated as inspection tool to evaluate the deformation induced by the thermal loading. Application of DH on structures with several different geometries and shapes, like cantilever beams, bridges and membranes is reported and results will be discussed. Dimensions of the inspected microstructures, varies in the range 1divided by150 mum. The experimental results shown that a “bimorph-effect” induces a deformation in MEMS structures. The difficulties encountered in performing the deformation analysis by digital holography in real-time will be afforded and discussed. A method with automatic focus tracking in Digital Holography is proposed allowing inspection of MEMS, under thermal loading, in real-time.
Journal/Review: PROCEEDINGS OF SPIE
Volume: 5145 Pages from: 146 to: 154
KeyWords: MEMS; digital holography; DOI: 10.1117/12.500657Connecting to view paper tab on IsiWeb: Click here