High-quality drilling with copper vapour lasers
Anno: 1995
Autori: Pini R., Salimbeni R., Toci G., Vannini M.
Affiliazione autori: Istituto di Elettronica Quantistica del CNR (IEQ-CNR), Via Panciatichi 56/30, Firenze, 50127, Italy
Abstract: High-quality materials processing on transparent substrates of BK7 glass, fused silica, corundum and ruby using a copper vapour laser (CVL) is described and discussed. The driling process using the radiation emitted by a small diffraction-limited CVL is described and investigated by optical diagnostic methods allowed by the transparency of the materials. In particular the hole making was entirely monitored in real time through a video camera. Images achieved in this way are reported to illustrate the morphology of the hole and of the ejected materials via the time-resolved fluorescence. This investigation provides the evaluation of the plume expansion speed, while the imaging supplies the quantitative evaluations of the drilling speed and threshold. The high quality of the hole in terms of wall smoothness and elevated aspect ratio is described in detail. We report according to our findings an interpretation of the peculiar combination of physical processes involved.
Giornale/Rivista: OPTICAL AND QUANTUM ELECTRONICS
Volume: 27 (12) Da Pagina: 1243 A: 1256
Parole chiavi: Aspect ratio; Copper; Corundum; Diffraction; Drilling; Fluorescence; Fused silica; Imaging techniques; Semiconducting glass; Substrates; Transparency; Video cameras, Copper vapour lasers; Metal vapour lasers; Optical diagnostic methods; Photoablative effects, Laser applicationsCitazioni: 7dati da “WEB OF SCIENCE” (of Thomson Reuters) aggiornati al: 2024-05-05Riferimenti tratti da Isi Web of Knowledge: (solo abbonati) Link per visualizzare la scheda su IsiWeb: Clicca quiLink per visualizzare la citazioni su IsiWeb: Clicca qui