Very large spot size effect in nanosecond laser drilling efficiency of silicon
Anno: 2010
Autori: Brandi F., Burdet N., Carzino R., Diaspro A.
Affiliazione autori: Nanophysics Group, Italian Institute of Technology, Via Morego 30, Genova, Italy
Abstract: The effect of the spot diameter in nanosecond excimer laser percussiondrilling of through via in silicon wafer is presented. Experimental resultsshow a ten fold increase of the ablation efficiency when decreasing the spot diameter from 220 µm to 9 µm at constant fluence in the range 7.5 J/cm2 to 13.2 J/cm2. Such effect is absent when using 60 ps deep-UV laser pulses. A model is developed that explain the findings in terms of plume shielding effect on the laser pulse. The model is successfully applied also on previously published data on deep-UV laser drilling of Polyimide and Alumina.
Giornale/Rivista: OPTICS EXPRESS
Volume: 18 (22) Da Pagina: 23488 A: 23494
Parole chiavi: UV LASER; ABLATION; PULSESDOI: 10.1364/OE.18.023488Citazioni: 35dati da “WEB OF SCIENCE” (of Thomson Reuters) aggiornati al: 2024-06-09Riferimenti tratti da Isi Web of Knowledge: (solo abbonati) Link per visualizzare la scheda su IsiWeb: Clicca quiLink per visualizzare la citazioni su IsiWeb: Clicca qui